Multi-wire cutting machines cut hard and brittle materials such as semiconductors into numerous thin slices through high-speed reciprocating motion of metal wires, which can achieve high-precision, high-speed, and low-loss cutting. With the rapid development of the photovoltaic industry, multi-wire cutting technology is mainly used for cutting silicon wafers. Sine Electric's multi-wire cutting machine solution can meet the requirements of complex machines such as high speed, high precision, and high performance. It is currently widely used in the fields of magnetic materials, crystal materials, precious metals, ceramics, and semiconductor materials

1. Traditional cutting tension is unstable and easy to break

2. Single process and poor cutting accuracy

3. High energy consumption

4. Equipment disconnection during abnormal power outage

Touch screen: WK2100-31ST

Controller: SMC300-016E+SMC300+16DI+SMC300+16DO

Servo drive: EA300E-2R5-1B------EA300E-062-3B

Motor: SES/SET/SEM series

Capacitor box: DR200-20060-3-D50

1. High work efficiency, hundreds of lenses can be cut at a time

2. Shallow surface damage layer of processed wafers, less cutting loss between wafers

3. Real-time calculation of reel diameter, through algorithm plus fuzzy PID control, the swing arm jitter is within ±1°

4. Precision cable control, can automatically correct deviation and reverse direction, keep cable operation stable

5. Real-time acquisition of the current torque of the main shaft, through closed-loop synchronous control, to achieve multi-axis torque balance

6. The common busbar solution can reduce electricity consumption by 5-15%

7. High line speed, up to 2400M/Min